Driving the Future of Next-Gen AI Semiconductors through Ceramic Innovation
Solving the physical limits of the AI era - Heat, Density, and Reliability. We build the foundations of the next-generation information society.
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01
Thermal Management
- To address the heat challenges of high-performance semiconductors, we are developing next-generation packaging that surpasses conventional alumina to meet escalating thermal demands.
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02
2.5D / 3D Packaging (Chiplets)
- To meet the growing demands for higher integration and miniaturization driven by chiplet technology and 2.5D/3D packaging, we are developing advanced substrate technologies that support heterogeneous integration.
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03
Large-Scale Substrates
- Leveraging our ceramic expertise, we provide fundamental solutions for large-scale AI chips, overcoming critical warpage (CTE mismatch) and heat challenges that exceed the limits of organic substrates.
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04
Low Electrical Resistance + High Strength
- To address the evolving needs for advanced circuit design, we provide next-generation high-functional substrates that fuse the robust reliability of alumina with superior conductivity.
