Product Concept
With the advancement of chiplet technology, next-generation package substrates are rapidly moving toward larger areas and higher densities. This has led to critical challenges, including warpage and reduced reliability due to CTE (Coefficient of Thermal Expansion) mismatch, heat dissipation limits caused by increased power density, and the cost, brittleness, and size constraints of silicon (Si) and glass materials.
To fundamentally address these issues, NTK CERAMIC has developed Ceramic Interposers by leveraging our proprietary ceramic technology. By utilizing the inherent advantages of ceramics, such as high rigidity, superior heat dissipation, and scalability to larger sizes, we provide optimal solutions for the thermal and mechanical challenges faced by cutting-edge semiconductor packaging technologies.
Structure
Prototypes (For prototype inquiries or documentation, please contact us)
Key Features
- The "third interposer" as an alternative to Si and RDL
- Higher fracture toughness than glass and capable of larger areas than silicon
- Supporting high-speed and high-frequency applications with high heat dissipation and low dielectric loss (low tan δ)
