High Pin Count & High-Density Assembly
Ensuring the quality of electrical test and assembly for high-performance semiconductors.
High rigidity and flatness ensure the contact accuracy of the STF (Space TransFormer) for probe cards, essential for AI/HBM memory chip testing, supporting the quality control and evolution of next-generation semiconductors.
Advanced multilayer wiring of complexity and precision ensures the degradation-free signal transmission to chip.
Improvement of reliability of first-level assembly using high-melting-point solder ensures successful complex heterogeneous chip integration.
Solution Showcase
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Consultation &
Customized Design -
Proposing optimal ceramic package structures and designs tailored to your needs.
"Complex geometries?" "Strict specs?" "Beyond rules?"
We respond flexibly to every unique challenge to co-create your optimal solution.
Please feel free to contact us.
