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Probe Cards
Microcontrollers (MCU) & Analog Devices
LEDs, Laser Diodes (LD) & Optical Devices
Imaging Devices
Power Semiconductors & RF Devices
MEMS Devices
Chip Testing
Other Multilayer Ceramic Substrates

Applications

Information / Communications
Mobility
Aerospace / Defence
Industrial / Factory Automation
Medical / Environment
Consumer Electronics

Package Types

PGA (Pin Grid Array)
BGA (Ball Grid Array)
LGA (Land Grid Array)
DIP (Dual Inline Package)
SOP (Small Outline Package)
QFP (Quad Flat Package)
LCC (Leadless Chip Carrier)
QFJ(Quad Flat Jlead)
SOJ(Small-Outline J-lead)
QFN(Quad Flat No Lead)
SMD Series
(MOSFET, Transistor, Switch)
LID (Ceramic・Kovar)
Other Package Types

Solutions

Thermal Management
Hermeticity & Moisture Resistance
High-Frequency Performance
Miniaturization, Low Profile Design & 3D Integration
High Pin Count & High-Density Assembly
Environmental Resistance & Reliability
Customized Design