Products
Products
Product Categories

Material Properties

Standard Packages List

Upcoming Solutions

About Ceramic Package
Applications
Applications
Information / Communications

Mobility

Aerospace / Defence

Industrial / Factory Automation

Medical / Environment

Consumer Electronics
Company Profile
Company Profile
Overview

Global Network

History
News

- JA
- EN

- JA
- EN

Home
News

News

Categories

ALL
Corporate
Products
Events
Topics

No news items were found.

TOP

Contact Us

Please feel free to contact us for any inquiries or consultations regarding Ceramic Packages.

Search Products

Product Categories
Applications
Package Types
Solutions

Product Categories
Material Properties
Standard Packages List
Upcoming Solutions
About Ceramic Package

Applications

Information / Communications
Mobility
Aerospace / Defence
Industrial / Factory Automation
Medical / Environment
Consumer Electronics

Company Profile

Overview
Global Network
History

News

Contact Us
Site Map
Privacy Policy

Copyright © NTK CERAMIC CO., LTD. All rights Reserved.

Standard Packages List
Contact Us
Downloads
Call Us
- Product Inquiries
  TEL +81-568-76-5349
- General Inquiries
  TEL +81-568-66-4913

CLOSE

Search Products

Products
Applications
Package Types
Solutions

Products

Probe Cards
Microcontrollers (MCU) & Analog Devices
LEDs, Laser Diodes (LD) & Optical Devices
Imaging Devices
Power Semiconductors & RF Devices
MEMS Devices
Chip Testing
Other Multilayer Ceramic Substrates

Applications

Information / Communications
Mobility
Aerospace / Defence
Industrial / Factory Automation
Medical / Environment
Consumer Electronics

Package Types

PGA (Pin Grid Array)
BGA (Ball Grid Array)
LGA (Land Grid Array)
DIP (Dual Inline Package)
SOP (Small Outline Package)
QFP (Quad Flat Package)
LCC (Leadless Chip Carrier)
QFJ(Quad Flat Jlead)
SOJ(Small-Outline J-lead)
QFN(Quad Flat No Lead)
SMD Series
(MOSFET, Transistor, Switch)
LID (Ceramic・Kovar)
Other Package Types

Solutions

Thermal Management
Hermeticity & Moisture Resistance
High-Frequency Performance
Miniaturization, Low Profile Design & 3D Integration
High Pin Count & High-Density Assembly
Environmental Resistance & Reliability
Customized Design