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PGA (Pin Grid Array)
BGA (Ball Grid Array)
LGA (Land Grid Array) - DIP (Dual Inline Package)
- SOP (Small Outline Package)
- QFP (Quad Flat Package)
- LCC (Leadless Chip Carrier)
- QFJ(Quad Flat Jlead)
- SOJ(Small-Outline J-lead)
- QFN(Quad Flat No Lead)
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SMD Series
(MOSFET, Transistor, Switch) - LID (Ceramic・Kovar)
- Other Package Types
LID (Ceramic・Kovar)
- Unit: mm
- Unit: inch
| PIN | CHIP CAVITY SIZE | OUTER DIMENSION | THICKNESS | LEAD PITCH | NTK PART NUMBER | DOWNLOAD | ||
| Ｘ | Ｙ | Ｘ | Ｙ | |||||
| - | 0.00 | 0.00 | 5.85 | 5.85 | 0.50 | - | IEK00Z0-1163A |
|
| - | 0.00 | 0.00 | 15.75 | 11.30 | 0.25 | - | IEBP-2145A-00 |
|
| - | 0.00 | 0.00 | 15.75 | 11.30 | 0.25 | - | IEBP-2145B-00 |
|
| PIN | CHIP CAVITY SIZE | OUTER DIMENSION | THICKNESS | LEAD PITCH | NTK PART NUMBER | DOWNLOAD | ||
| Ｘ | Ｙ | Ｘ | Ｙ | |||||
| - | 0.00 | 0.00 | 5.85 | 5.85 | 0.50 | - | IEK00Z0-1163A |
|
| - | 0.00 | 0.00 | 15.75 | 11.30 | 0.25 | - | IEBP-2145A-00 |
|
| - | 0.00 | 0.00 | 15.75 | 11.30 | 0.25 | - | IEBP-2145B-00 |
|
LID (Ceramic・Kovar)
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