New Circuit Patterning Method
Product Concept
Advancing density and perf ormance in semiconductor packaging demand fine and high-pr ecision patterning
beyond the c apabilities of conventional printing me thods.
NTK CERAMIC developed a ne w circuit patterning method surpassing limits of conventional printing in alumina
packaging, achieving fine patterning with stable pattern shapes and high r eproducibility.
Enlarged photo
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Comparison of Conventional printing method
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Comparison of wiring cross-sections
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Observation at a 25 deg angle
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Land dia Φ50μm
Structure
Key Features
By adopting ultra-high-density wiring through our ultra-fine wiring technology, we enable our products for a wide range of applications, including high-performance semiconductor test packages and industrial packages.
- Inner signal layers L/S=20/20μm wiring
- PWR/GND layers 25μm bridge
- Sheet resistance 6mΩ□ （50μm width trace）
- Characteristic impedance 50 +/- 2Ω
