We will be showcasing new circuit formation methods currently under development at the
NEPCON JAPAN – 40th Electronics R&D, Manufacturing and Packaging Technology Expo
, to be held at Tokyo Big Sight from January 21st (Wed) to January 23rd (Fri), 2026.

Technology Features:
By adopting the fine wiring technology of this new circuit formation method, it will be possible to use it in a variety of applications, including high-performance semiconductor testing packages and industrial packages.
   Signal line: L/S=20/20μm wiring
   Power supply GND layer: 25μm bridge
   Sheet resistance: 6mΩ (50μm wiring)
   Characteristic impedance: 50±2Ω

We look forward to seeing you there.
 

Dec 9th, 2025

We will be exhibiting high-heat dissipation substrates currently under development at the
NEPCON JAPAN – 40th Electronics R&D, Manufacturing and Packaging Technology Expo, to be held at Tokyo Big Sight from January 21st (Wed) to January 23rd (Fri), 2026.

As heat generation increases, insulating materials (ceramics) are required to have higher thermal conductivity, but there have not been many insulating substrates with thermal conductivity exceeding that of aluminum nitride.

Today, we will be introducing a "high-heat dissipation substrate" that we are currently developing, which has a thin insulating film formed on a copper base.

By using Cu, which has high thermal conductivity, as the base material and forming a thin

insulating film on top, we have created a semiconductor package substrate that maintains insulation while also offering high heat dissipation performance.

We look forward to seeing you there.

Dec 9th, 2025

We will be exhibiting various aluminum nitride products currently under development at the
NEPCON JAPAN – 40th Electronics R&D, Manufacturing and Packaging Technology Expo, to be held at Tokyo Big Sight from January 21st (Wed) to January 23rd (Fri), 2026.

In application fields such as photonics-electronics convergence and increasingly high-power RF power devices, Si photonics, LEDs, and laser diodes, substrate materials must combine high heat dissipation and high reliability.

Our aluminum nitride has significantly higher thermal conductivity than conventional alumina ceramic materials and a thermal expansion coefficient close to that of silicon. This allows it to quickly dissipate high heat (high heat dissipation) and reduce thermal stress on silicon chips, making it an essential solution for stable operation and long lifespan of high-performance, high-power devices.

Please come and see them at the venue.
We look forward to your visit.

Dec 9th, 2025

We will be exhibiting Ceramic Interposers and Ceramic Cores at the NEPCON JAPAN – 40th Electronics R&D, Manufacturing and Packaging Technology Expo, to be held at Tokyo Big Sight from January 21st (Wed) to January 23rd (Fri), 2026.

Next-generation 3D packaging technology is a growth area where ceramics can best demonstrate their capabilities, due to the widespread use of chiplets, larger and denser packages, and the resulting intensifying thermal challenges.

The development of ceramic interposers was primarily driven by the limitations of existing interposer materials (silicon, organic resin, and glass) and the market need for higher performance. Their key differentiator is their excellent balance of mechanical strength and electrical properties, making them particularly suitable for applications requiring high performance and reliability.

Furthermore, ceramic core substrates have been developed as a technology that combines the low cost and large surface area advantages of organic resin substrates with the excellent electrical properties and dimensional stability of glass substrates, all while maintaining high mechanical strength. This technology is expected to enable larger, lower-cost, and more mass-producible high-performance packages.

Come see our cutting-edge technologies supporting next-generation 3D packaging at the event.
We look forward to seeing you.
 

Dec 9th, 2025

We will be exhibiting at the NEPCON JAPAN – 40th Electronics R&D, Manufacturing and Packaging Technology Expo , to be held at Tokyo Big Sight from January 21st (Wed) to January 23rd (Fri), 2026.

At this exhibition, we will introduce the latest technologies and products in our ceramic packaging business.

We look forward to seeing you there.

Dates and Venue
Show Name: NEPCON JAPAN 2026 – 40th Electronics R&D, Manufacturing andPackaging Technology Expo
Dates: January 21st (Wed) to January 23rd (Fri), 2026
Venue: Tokyo Big Sight, Japan
Booth Number: E25-19

Dec 9th, 2025

Our ceramic package for co-packaged optics (CPO) will be exhibited at the National Instituteof Advanced Industrial Science and Technology (AIST) booth during SEMICON JAPAN 2025. The event will be held at Tokyo Big Sight from Wednesday, December 17 to Friday, December19, 2025.

Reducing the power consumption of data centers as AI and big data become more widespreadis a top priority for realizing a sustainable society. We are participating in the Council onDevices and Systems for Next Generation Green Data Centers (GDC Council), a consortiumled by AIST, which is working on the development of next-generation technologies to solve theproblem. We provide highly rigid and reliable ceramic packages that are ideal for the CPOapplications.

At the AIST booth, which showcases its CPO technology, a concept model of the next-generation photonics-electronics convergence technology, "Active Optical Package (AOP)", willbe exhibited. This model features a Photonic IC chip and an optical waveguide mounted in aceramic package provided by our company.

You are invited to visit the AIST booth at SEMICON JAPAN 2025 to see our cutting-edge technology that enables next-generation green data centers.
We sincerely look forward to sharing our contribution with you there.

Dates and Venue
Date: December 17th (Wednesday) - December 19th (Friday), 2025
Venue: Tokyo Big Sight
Booth number: W2708

Dec 9th, 2025

We will be exhibiting aluminum nitride (AlN) substrates and packages currently under development at the Semiconductor Technology Expo in Kyushu to be held at Marine Messe Fukuoka from Wednesday, October 8th to Thursday, October 9th, 2025

Aluminum nitride has high thermal conductivity, high insulation properties, and a thermal expansion coefficient similar to that of silicon. Taking advantage of these characteristics, aluminum nitride substrates and packages are used in high-frequency communication equipment, power semiconductors, LEDs, medical equipment, and more.

Our exhibition booth will feature large aluminum nitride substrates and standard SMD products, so please stop by.

Aluminum nitride substrates can be manufactured in single layer or multilayer configurations, so please contact us here for inquiries regarding development and prototyping.

Aug 18th, 2025

We will be exhibiting at SEMICON INDIA 2025 from Tuesday, September 2nd to Thursday, September 4th, 2025.

At this exhibition, we will introduce the latest technologies and products in our ceramic packaging business at the Global Marketing Services booth.

We look forward to your visit.

Dates and Venue

Dates: September 2nd to September 4th, 2025

Venue: Yashobhoomi (IICC), New Delhi, India

Booth number: 1276 (Global Marketing Services)

Aug 11th, 2025

We will be exhibiting at The 38th Microelectronics Workshop (MEWS38), to be held at the Tsukuba International Congress Center from Thursday, October 23rd to Friday, October 24th, 2025.

At the exhibition venue, we will be showcasing our ceramic packaging technologies and products related to space components.

Please be sure to stop by our booth.

Dates and Venue

Dates : October 23th (Thu.) - 24th(Fri.), 2025
Venue : Tsukuba International Congress Center

Aug 8th, 2025

We will be exhibiting at the Semiconductor Technology Expo in Kyushu to be held at Marine Messe Fukuoka from Wednesday, October 8th to Thursday, October 9th, 2025.

At this exhibition, we will introduce the latest technologies and products in our ceramic packaging business. Please come to the venue to see our innovative solutions that contribute to the development of the semiconductor industry.

We look forward to seeing you there.

Dates and Venue

Dates: October 8th to October 9th, 2025

Venue: Marine Messe Fukuoka

Booth number: B7-22

Jul 7th, 2025