We ill be exhibiting our ceramic package for co-packaged optics (CPO) at the NEPCON JAPAN – 40th Electronics R&D, Manufacturing and Packaging Technology Expo, to be held at Tokyo Big Sight from January 21st (Wed) to January 23rd (Fri), 2026.

Reducing the power consumption of data centers as AI and big data become more widespreadis a top priority for realizing a sustainable society. We are participating in the Council onDevices and Systems for Next Generation Green Data Centers (GDC Council), a consortiumled by AIST (a National Institute of Advanced Industrial Science and Technology), which is working on the development of next-generation technologies to solve theproblem. We provide highly rigid and reliable ceramic packages aimed at realizing CPO technologies.

At this exhibition, we will be exhibiting a concept model of our next-generation optoelectronic convergence technology, "Active Optical Package (AOP)," which combines an optical IC chip and optical waveguide in our ceramic package.

We hope you will come and see our cutting-edge technology, which supports next-generation green data centers.

We look forward to seeing you there.

Dates and Venue
Dates: Wednesday, January 21, 2026 - Friday, January 23, 2026
Venue: Tokyo Big Sight
Booth Number: E25-19

Jan 13th, 2026