Large-Size Aluminum Nitride (AlN) Substrates
Product Concept
The shift to chiplets drives larger, denser packaging, causing issues like warpage from CTE mismatch,
thermal limits, and the fr agility or siz e constraints of silicon and glass ma terials.
NTK CERAMIC develops innovative materials and structures to fundamentally resolve these challenges.
Prototypes
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Large size substrate（Size φ300mm）
Key Features
- Superior Heat Dissipation: 170 W/(m·K)
- CTE closely matched to Silicon: 4.9 (x10-6/K)
- Stable Substrate for High-Reliability and High-Output Devices
- Large Wafer Size Compatibility: φ300mm
