High Heat Dissipation Insulated Substrate
Product Concept
The amount of heat generated by semiconductor devices is increasing year by year due to their higher output and integration.
As a result, new heat dissipation approaches are required to meet higher heat dissipation requirements.
To address this, we are developing a next-generation high heat dissipation insulated substrate by forming an insulating film on a copper base. Through this, the limitations of material properties are shattered by structure, and ideal thermal management is realized.
Prototypes
Structure
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Position of High heat dissipation insulated substrate:
Application example：As application of high heat dissipation insulated substrates,inlay substrates are also under development.
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Cross section image
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Externals(Mockup)
Key Features
- Thin-film insulation layer provides both high heat dissipation and insulation
- Flip-chip assembly compatible
- Low warpage design
