News

We are pleased to announce that we will present our latest research at 2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026), held from April 14 to 18, 2026, at the International Conference Center Hiroshima.

On April 16, we will showcase our development of a next-generation thermal management solution: an Insulated Metal Substrate (IMS) utilizing a thin ceramic insulating film. This technology addresses the critical heating challenges in high-density electronic devices and power modules.

 

[Key Presentation Highlights]

•   – Innovative Heat Dissipation Structure: By forming a proprietary thin-film ceramic insulation layer on a copper substrate, we have achieved thermal performance that surpasses conventional Aluminum Nitride (AlN) substrates.
•   – Significant System Miniaturization: Thermal simulations of an automotive headlamp unit demonstrated a potential 40% reduction in heat sink volume while maintaining equivalent cooling performance.
•   – Superior Thermal Resistance: Our research confirmed a 24–25% reduction in thermal resistance compared to standard AlN substrates.

 

[Presentation & Conference Details]

• 　Presentation Time: Thursday, April 16, 2026 | 11:25 AM – 1:05 PM (Within the scheduled session)
• 　Venue: Room F (International Conference Center Hiroshima)
• 　Title: Development of high heat dissipation Insulated metal substrates using thin insulating films
• 　Conference: 2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)
• 　Event Dates: April 14 (Tue) – April 18 (Sat), 2026

 

We remain committed to overcoming the limits of conventional materials through structural innovation, providing ideal thermal management solutions for the future of electronics. We look forward to seeing you in Hiroshima.