News

We are pleased to announce our participation in SEMISOL 2026, held at Tokyo Big Sight from June 10th to 12th, 2026.

Next-generation AI, 5G/6G, IoT, and automotive applications: the semiconductor packaging technologies supporting these fields are currently at a major turning point driven by “chiplet” integration. To overcome the critical limits of warpage and thermal management caused by increased size and density, the industry requires new material alternatives to conventional Si (silicon) and glass.

At our booth, we offer a platform for “Co-creation” to realize your innovative device designs. We will showcase our Ceramic Interposer Substrates – the highly anticipated “Third Interposer” – alongside our Ceramic Core Substrates for stable support of large-area packages, high-thermal conductivity Aluminum Nitride (AlN) substrates, and our unique Translucent Ceramic Substrates.

For more information about our exhibits or to discuss potential prototyping and customization, please feel free to speak with our staff at the booth. You may also contact us anytime via our Inquiry Form.

We look forward to welcoming you to our booth.

Event Details

　Exhibition: SEMISOL 2026 (Advanced Semiconductor Packaging Technology & Solutions Expo)

　Dates: June 10 (Wed) – 12 (Fri), 2026

　Venue: Tokyo Big Sight, West Hall 3

　Booth Number: G-06