Ceramic Cores
Product Concept
The shift to chiplets drives larger, denser packaging, causing issues like warpage from CTE mismatch,
thermal limits, and the fr agility or siz e constraints of silicon and glass ma terials.
NTK CERAMIC develops innovative materials and structures to fundamentally resolve these challenges.
Structure
Prototypes
Key Features
- A reliable core material that resists distortion and breakage even over large areas
- Stable support for large-area packages through high strength and high flatness
- Excellent electrical properties and dimensional stability comparable to glass substrates
