Ceramic Interposers
Product Concept
The shift to chiplets drives larger, denser packaging, causing issues like warpage from CTE mismatch,
thermal limits, and the fr agility or siz e constraints of silicon and glass ma terials.
NTK CERAMIC develops innovative materials and structures to fundamentally resolve these challenges.
Structure
Prototypes
Key Features
- The "third interposer" as an alternative to Si and RDL
- Higher fracture toughness than glass and capable of larger areas than silicon
- Supporting high-speed and high-frequency applications with high heat dissipation and low dielectric loss (low tan δ)
